Non-cyanide coarse Ag plating that achieves controllable porous structures.
It is possible to control the porous structure with a spiny morphology like that of a porcupine!
The bonding strength between the epoxy resin that encapsulates the semiconductor and the nano silver paste used for mounting has improved. Utilizing a large surface area, applications in electrochemical sensors are also anticipated.
- Company：Daiwa Fine Chemicals Co., Ltd.
- Price：Other
